Conference overview
About this event
The 28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2027) will take place from April 11–14, 2027 in Regensburg, Germany.
EuroSimE addresses fundamental research and industrial applications related to thermal, mechanical and multiphysics simulation and experiments of micro- and nano-electronics and microsystems.
Topics and subtopics
Electrical
Engineering
Information Technology
Manufacturing
Scholar Discussion
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