Conference overview
About this event
The 26th European Microelectronics & Packaging Conference (EMPC 2027) will take place from September 14–16, 2027 in Ingolstadt, Germany.
EMPC 2027 seeks original, non-commercial contributions presenting research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit abstracts describing recent work, clearly outlining the objectives and demonstrating new results.
Topics and subtopics
Electrical
Engineering
Information Technology
Scholar Discussion
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